Cleanly remove epoxy resin from electronic components and circuit board jigs! Ultra-high pressure water cleaning device.
Peeling epoxy resin from SUS plates for electronic components and substrate jigs using ultra-high pressure water.
The hardened epoxy resin, ink, adhesive, tape, etc. adhered to the SUS plate for jigs will be cleaned with only water. A small amount of water will be used for double-sided cleaning at ultra-high pressures ranging from 50 MPa to 250 MPa.
- Company：ワールドエンジニアリング
- Price：Other
